Your Accurate Search for New Technology
By Steve Bush
Tektronix has created a automated double-pulse test set-up for GaN and SiC power supply designs, that also works with silicon mosfets and IGBTs. Called ‘WBG-DPT Solution’, it is a combination of test gear from its existing equipment portfolio, and software for that test gear, which makes measurements to JEDEC and IEC standards where applicable. “With …
The post Automatic double-pulse testing for GaN and SiC power design appeared first on Electronics Weekly .
By Steve Bush
Rohm is aiming at motor drives operating on 24, 36 or 48V with n-channel mosfets rated at 40, 60, 100 or 150V to give some leeway for spikes and noise. There are two series with 13 devices all-told: nine in 5x6x1mm HSOP8 (below left) packaging called RS6xxxx, and four in 3x3x0.8mm HSMT8 packaging called RH6xxxx, …
The post Mosfets for motor drives up to 48V appeared first on Electronics Weekly .
By Steve Bush
CUI has three new micromachined omnidirectional microphones for portable devices and wearables, that can work across 20 to 20,000 Hz. CMM-2718AB-38162W-TR, CMM-2718AB-38164W-TR and CMM-2718AT-38164W-TR are analogue mems microphones with accurate -38dB ±1dB sensitivity ratings. There are top or bottom port versions, in packages down to 2.75 x 1.85 x 0.9mm, that can be reflow soldered. …
The post 3mm microphones for wearables and portables appeared first on Electronics Weekly .
Kioxia is sampling UFS Ver. 4.0 embedded flash memories which integrate BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2Gbps per lane or 46.4Gbps per device. UFS 4.0 is backward compatible with UFS 3.1. …
The post Kioxia sampling UFS 4.0 appeared first on Electronics Weekly .
TT Electronics has announced a series of shunt resistors for high current measurements in the hundreds of amps range. With a temperature range from –65 to +170°C and AEC-Q200 qualification, the EBW5216 series is suitable for industrial and energy management applications, including welding power supplies, motor drives, battery management, energy metering, and process control. The …
The post Shunt resistors with a wide temperature range appeared first on Electronics Weekly .
The UK has hosted the first AUKUS AI and autonomy trial, with the aim of driving artificial intelligence into military use. Service personnel, scientists and engineers from the three AUKUS nations (Australia, United Kingdom, United States) combined for the exercise taking place on the Salisbury Plains. It saw “AI-enabled assets” involved in a collaborative swarm …
The post UK hosts inaugural AUKUS AI and autonomy trial appeared first on Electronics Weekly .
Researchers at IBM and ASMPT have developed a new way to bond chiplets that fuses copper and an oxide in layers that are just a few atoms thick using no solder. The result is a bond between chiplets that’s only around 0.8 microns, compared to the 150-30 microns being achieved by solder, or a combination …
The post IBM and ASYMPT develop better chiplet bond appeared first on Electronics Weekly .
By Steve Bush
Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], …
The post X-Fab offers 110nm BCD-on-SoI process appeared first on Electronics Weekly .
By Steve Bush
Semidynamics has announced a customisable vector unit for RISC-V processor cores, compliant with RISC-V vector specification 1.0. Vector unit are composed of several vector cores that perform multiple calculations in parallel. In this case, Semidynamics’ vector core can be tailored to support FP64, FP32, FP16, BF16, INT64, INT32, INT16 or INT8 data types depending on …
The post RISC-V Summit: Customisable vector unit appeared first on Electronics Weekly .
By Steve Bush
Fuji Corporation has joined 3d printed electronics association JAMES (Jetted Additively Manufactured Electronics Sources), which describes itself as establishing a collaborative community that brings together professionals and enthusiasts from various fields to drive additive manufacturing development in 3D printed electronics. The addition of Fuji “will allow both companies to work together on upcoming projects, share …
The post Fuji joins 3d printed electronics alliance appeared first on Electronics Weekly .