Fine is the largest issued in years by state environmental regulators.

Dialog will start sampling GaN power ICs in Q4 with a fast charging power adapter made on TSMC’s 650-volt GaN-on-Silicon process technology. The DA8801 together with Dialog’s patented digital Rapid Charge power conversion controllers will enable more efficient, smaller and higher power density adapters compared to traditional Silicon field-effect transistor (FET) based designs, says the company. …

Read full article: Dialog enters GaN market

u-blox, the Swiss wireless and GPS IC specialist, has signed up with Digi-Key to distribute its products in th

Read full article: Digi-Key signs u-blox

MCU is expected to reach record-high annual revenues through the second half of this decade despite an overall slowdown in unit growth

Read full article: MCU to grow 4% to $16.6bn, says IC Insights

Maxim has developed an IoT development design to provide protection against counterfeit sensor data along the entire data chain, from transducer to the cloud.

Read full article: Maxim offers data counterfeit protection for IoT

Heliatek has installed the second phased of organic photovoltaic solar cells on its Singapore pilot project. The opaque organic solar film was installed on the west façade of a building called Cleantech I on steel panels with 56 2m-long films and 45 films of 3.25m-long laminated into 15 glass sheets. Prior to this, 87 soar …

Read full article: Organic solar cells face large scale tropical test

Schaffner has expanded its range of common-mode EMC chokes. The current-compensated inductors now have horizontal and vertical mounting options for currents between 0.3 and 10A and the RN series is now rated up to 300Vac. RN dual chokes are available over 0.4 to 100mH operating over DC to 60Hz with common-mode resonance between 100kHz and …

Read full article: Common-mode EMC chokes offer up to 10A

Korean process engineers have developed a chip packaging technology that creates flexible integrated circuits. The process starts with a flash memory wafer diced after thinning to ~100nm. These die are attached to a plastic carrier film, which allows them to be transferred to a roller and pressed onto a flexible PCB supported by a flat …

Read full article: Korea develops roll-based packaging for flexible silicon ICs

Big data analysis of mobile phones is as good as existing survey techniques for town transport planners, but much cheaper, claims MIT and Ford. “Applying the system to six weeks of phone location data from residents of the Boston area, the researchers were able to assemble the kind of model of urban mobility patterns that …

Read full article: Phone data is good for town planning

From Lancaster University, ShapeClip is a prototype system that ambitiously aims to “turn any display into a shape-changing display”

Read full article: ShapeClip trips the light fantastic