Kuwait anticipates awarding eight public-private partnership contracts in the power and water sector worth KD 2.1 billion ($7.1 billion) in Q4 2016 and Q1 2017, says National Bank of Kuwait.

At Electronica 2016 ams, the sensor and analogue IC specialist, is launching a pre-calibrated relative humidity and ambient temperature single-die sensor IC. The ENS210 provides output in Kelvin, accurate to a maximum +/-0.2 degree C over the range of 0 to 70 degree C. It also provides relative humidity measurements as a digital output accurate …

Read full article: Electronica: ams pre-calibrates humidity and temperature on single-die sensor IC

Toshiba is to expand production of its proprietary 3D flash non-volatile memory and has announced plans to build a wafer fabrication facility at Yokkaichi, Japan for expanded production of BiCS Flash. The production line will use artificial intelligence (AI) for the first time. The plan to build a new 3D flash facility was announced in March, and construction will now start …

Read full article: Electronica: Toshiba to build new 3D flash memory fab

Power Integrations has introduced an off-line switcher IC with safety features including input over-voltage, input under-voltage protection, output short-circuit and over-temperature protection, plus a rugged 725V mosfet. Called LinkSwitch-TN2, it can be used for non-isolated applications delivering up to 360mA, as well as be configured as a buck, buck-boost or a non-isolated flyback converter. Intended applications include: …

Read full article: Electronica: Power Integrations improves non-isolated ac-dc

At Electronica 2016, we caught up with Doug Steele, Harwin’s v-p of sales and marketing. He talks about Harwin’s secure, space saving Gecko Screw-Lok connector for harsh environments. Thank you to Doug Steele for his time. Read all our Electronica 2016 coverage »

Read full article: Electronica: Video Interview – Harwin’s Gecko Screw-Lok connector for harsh environments

At Electronica 2016 we caught up with Peter Wood, DesignSpark Digital Marketing Manager. He talks about how RS supports millions of engineers around the globe room the design to the maintenance of their products and systems.

Read full article: Electronica: Video Interview – RS Components on the Engineer’s Playground

Continuing to drive innovation in USB technology, FTDI Chip has now introduced a series of USB 3.0 UVC class bridge ICs. The company’s FT602 devices support the streaming of video content from high definition camera equipment. This means that imaging systems which would have previously only been capable of delivering relatively low resolution material can …

Read full article: FTDI Chip intros USB 3.0 UVC class bridge ICs

The route to the driverless car is far from straightforward. If anyone knows that, it is NXP, which is the world’s largest supplier of chip technology to the automotive industry and thought to have been recently bagged up by Qualcomm for precisely that reason. “I would say there are four elements which are fundamental for …

Read full article: Electronica: NXP’s route to driverless cars

Thsnks to the FT for this one – the top ten schools for MBA classes in 2016: Insead Harvard London Business School Univ of Pennsylvania: Wharton Stanford School of Business Columbia Business School Univ of California at Berkeley: Haas Univ of Chicago: Booth MIT: Sloan Univ of Cambridge: Judge

Read full article: Top Ten MBA Schools

At Electronica 2016 we caught up with Graham Dale, director of research and development at Pickering Electronics. Reed Relays for high voltage applications and the miniaturisation of Reed Relays are among the topics discussed. Thank you to Graham for his time. Read our full Electronica 2016 coverage »

Read full article: Electronica: Video Interview – Pickering on the miniaturisation of Reed Relays