Today, we announced the AWS Migration and Modernization Competency. These AWS Partners have deep domain expertise in offering software products that enable customers to migrate and modernize applications while customers move to the cloud. AWS Migration and Modernization Competency Partners can help customers optimize cost and reduce TCO, modernize legacy applications and data, and reduce operational burden.

We are excited to announce the public preview of Amazon Athena ACID transactions, a new capability that adds write, delete, update, and time travel operations to Athena’s SQL data manipulation language (DML). Athena ACID transactions enables multiple concurrent users to make reliable, row-level modifications to their Amazon S3 data from Athena’s console, API, and ODBC and JDBC drivers. Built on the Apache Iceberg table format, Athena ACID transactions are compatible with other services and engines such as Amazon EMR and Apache Spark that support the Iceberg table format.

Starting today, you can use Recycle Bin for EBS Snapshots to recover from accidental snapshot deletions to meet your business continuity needs. Previously, if you accidentally deleted a snapshot, you would have to roll back to a snapshot from an earlier point in time, increasing your recovery point objective. With Recycle Bin, you can specify a retention time period and recover a deleted snapshot before the expiration of the retention period. A recovered snapshot retains its attributes such as tags, permissions, and encryption status, which it had prior to deletion, and can be used immediately for creating volumes. Snapshots that are not recovered from the Recycle Bin are permanently deleted upon expiration of the retention time.

Hoarding is the problem, Ed confides to his diary, hoarding is prolonging the chip shortage while enriching a few unscrupulous dealers. It is my duty to get abreast of this. I call in the Permanent Secretary. “It’s very important that we find out where chips are being hoarded and by whom,” I tell him. “Absolutely, Secretary …

This story continues at Ed Tackles Hoarding

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Building on the program where the different elements of its 4mm-pitch Datamate Mix-Tek connectors can be sourced separately, Harwin now offers a new female contact option to its customer base. Like all Mix-Tek coax contacts, the M80-310 is designed for data carrying, with support for frequencies reaching up to 6GHz. This latest contact can be …

This story continues at Harwin adds female contact to Datamate

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ICEYE, the Finnish satellite imagery specialist, has entered into an R&D agreement with the U.S. Army to advance the Earth observation technology supporting army missions. Specifically, the cooperative research and development agreement (CRADA) is with the U.S. Army’s Space and Missile Defense Technical Center (SMDTC). They will explore together low-cost, on-orbit, synthetic-aperture radar (SAR) related …

This story continues at U.S. Army turns to ICEYE for SAR mission imagery

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The power module market will reach $9.5 billion by 2026, with a 10.5% CAGR between 2020 and 2026, says Yole Develeloppement. The related packaging market will have a 12.5% CAGR during the same period, to about $3.5 billion. The cost of raw materials for power module packaging represents about 33% of the total power module …

This story continues at Power module packaging market on a 12.5% CAGR 2020-6

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  Sir James Dyson has come up with a new approach to retailing where you can try out products via a VR demo using an Oculus Rift head-set. “We have been harnessing powerful virtual reality technologies to engineer new products in our labs for many years, now we are applying those same technologies to re-invent …

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Raspberry Pi is expected to IPO in the Spring at a valuation of £370 million.  Bankers Stifel and Liberum have been hired to advise on a London float. In September, the Raspberry Pi Foundation sold stakes worth £33 million to Lansdowne Partners and the Ezrah Charitable Trust. Raspberry Pi made a profit of £11.4 million last …

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Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and CSP assemblies does not provide the level of thermal fatigue resistance required by automotive, aerospace, military and semiconductor manufacturers. To ensure that these assembled components are able to withstand long periods of exposure in harsh …

This story continues at Sponsored Content – High Reliability Underfills for Automotive Applications

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