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HyImpulse Technologies, a launch services provider, has secured an additional €30 million in financing, including raising €15 million in equity capital, as part of its Series A funding round. The …
The post HyImpulse secures €30m funding for hybrid propulsion appeared first on Electronics Weekly .
Arm Flexible Access, the low-cost mechanism for designing on Arm, is to become available for the Armv9 edge AI platform. The Armv9 Edge AI Platform – introduced earlier this …
The post Arm provides Flexible Access for v9 edge AI platform appeared first on Electronics Weekly .
TSMC is to break ground on its 1.4nm fab in Taichung’s Central Taiwan Science Park on November 5th, says Taiwan’s Economic Daily News. The fab is scheduled to begin mass …
The post TSMC to break ground on 1.4nm fab on Nov 5th appeared first on Electronics Weekly .
Today, Chipmind, the European startup building AI agents to accelerate IC development, is launching Chipmind Agents to empower engineering teams in semiconductor companies to speed-up the path from specification to …
The post Chipmind Agents take care of the tedious tasks in IC development appeared first on Electronics Weekly .
By Steve Bush
Segger has announced an industrial-grade 13 port USB-C hub. Called USB Hub-13, it is an extension of the company’s earlier USB Hub-7. “USB Hub-13 is an ideal partner for gang-programming …
The post 13 port industrial USB-C hub appeared first on Electronics Weekly .
The circular investments of the big AI players – all investing in eachother – has left analysts perplexed and regulators worried. Each time one of these deals is announced, the …
The post The Bollox-Go-Round appeared first on Electronics Weekly .
By Steve Bush
Sufficient vision for reading has been restored to volunteers with ‘dry age-related macular degeneration’ in a trial of an electronic eye implant. The implant, which works with custom AR glasses …
The post Electronic eye implant for macular degeneration appeared first on Electronics Weekly .
The Ultra ECDP (electrochemical deplating) tool is designed specifically for wide bandgap compound semiconductor manufacturing, said ACM Research. It delivers uniform processing outside of the wafer pattern area with minimal …
The post Gold deplating tool is for wide bandgap compound semiconductor manufacture appeared first on Electronics Weekly .
The Gulf nation of Oman has announced a new 45 day space launch approval process, which is designed to position Etlaq Spaceport for more international flights. The country’s Civil Aviation …
The post Oman CAA positions Etlaq Spaceport as Middle East orbit gateway appeared first on Electronics Weekly .
The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a call for papers around the theme: “Advancing the AI Frontier through VLSI Innovation.” The Symposium will be held …
The post Honolulu Symposium seeks papers on VLSI innovation for AI appeared first on Electronics Weekly .