Amazon Lex is a service for building conversational interfaces into any application, using voice and text. With Amazon Lex, you can quickly and easily build sophisticated natural language conversational bots (“chatbots”), virtual agents, and interactive voice response (IVR) systems. We are excited to announce the general availability of Analytics on Amazon Lex. Analytics gives access to rich insights and prebuilt dashboards related to Lex conversations, intents, slots, and utterances.

Starting today, memory-optimized Amazon Compute Cloud (Amazon EC2) X2idn instances are available in Middle East (Dubai) and Europe (Zaragoza) regions. These instances, powered by 3rd generation Intel Xeon Scalable Processors and built with AWS Nitro System, are designed for memory-intensive workloads. They deliver improvements in performance, price performance, and cost per GiB of memory compared to previous generation X1 instances. These instances are SAP-certified for running Business Suite on HANA, SAP S/4HANA, Data Mart Solutions on HANA, Business Warehouse on HANA, SAP BW/4HANA, and SAP NetWeaver workloads on any database.

Today, AWS announces support for starting Amazon CodeCatalyst workflows based on pull request events in linked GitHub repositories. When a workflow is triggered by a GitHub-based pull request, users will also be able to see the name of the PR that triggered it in the CodeCatalyst workflows UI, and click a link that takes them directly to the pull request in GitHub.

We’re excited to announce significant improvements to the AWS Amplify JavaScript library, by reducing the bundle sizes for our Auth, Storage, Notifications, and Analytics categories. We’ve improved our codebase so that you get leaner bundles, resulting in faster load times and improved performance for your applications. You can benefit from these improvements by installing or updating to version 5.3.4 or beyond of the Amplify JavaScript library.

At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes, says Knometa Research. While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly …

The post 167 300mm fabs this year; 180 next year appeared first on Electronics Weekly .

The Wimbledon final might be the last when we see the rituals of a Djokovic appearance – the extensive pre-serve ball-bouncing, extended loo-breaks, time-wasting, racquet abuse, mind games and flashes of temper. The crowd, rightly IMHO, showed their displeasure at these antics. Djokovic was on the verge of equaling three records: Most consecutive Wimbledon titles …

The post Gamesmanship appeared first on Electronics Weekly .

Orbital Composites, an in-space robotic manufacturing specialist, has won a $1.7m U.S. Space Force contract, to further “the development of In-space Servicing, Assembly and Manufacturing (ISAM) of antennas”. Collaborating with Axiom Space, Northrop Grumman, and Southwest Research Institute (SwRI), Orbital will be working on two applications: Satellite-Based Cellular Broadband (SBCB) and Space-Based Solar Power (SBSP). …

The post Orbital wins $1.7m Space Force contract to manufacture antennas in space appeared first on Electronics Weekly .

SMIC chairman Gao Yonggang has resigned in a long line of departures, to be replaced by a vice chairman Liu Xunfeng (pictured). Gao, who was CFO before becoming chairman, had been in the job for 12 months. No reason was given for him leaving except that it was ‘a job adjustment’. The new chairman, Liu …

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At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes. While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production …

The post 167 300mm fabs operating this year; 180 next year appeared first on Electronics Weekly .

The first public demonstration of Hummingbird, claimed to be the world’s first Optical Network-On-Chip for domain-specific AI workloads, will be at Hot Chips August 27-29 at Stanford University. Hummingbird uses vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into one package serving as the communications network for data centres and …

The post Hummingbird claims to be world’s first oNOC for AI workloads appeared first on Electronics Weekly .