Thanks to TrendForce for this one – the top ten foundries in Q1:

The post Top Ten Foundries Q1 appeared first on Electronics Weekly .

Microchip Technology has announced a 32bit 200MHz version of its dsPIC33 series of DSP-heavy MCUs. dsPIC33A, as the family will be called, is aimed at fast closed-loop control of PSUs …

The post 32bit dsPIC DSP-enabled MCUs from Microchip appeared first on Electronics Weekly .

CUI Devices has added tweeters to its range of loudspeakers. Called the CTW range, there are six tweeters, measuring from 30.5 x 30.5mm to 58.8 x 58.8 mm, and between …

The post CUI gets into tweeters appeared first on Electronics Weekly .

Molex has  brought out its Percept Current Sensors to provide busbar current sensors in industrial and automotive applications. The sensors combine Infineon’s coreless current sensors and Molex’s electronics packaging to  reduce …

The post Molex and Infineon hook up on coreless sensors appeared first on Electronics Weekly .

Binder is adding an M8 12-pin circular connector to its industrial portfolio. Featuring 12 pins on the compact M8 connector face, the connectors are aimed at projects requiring miniaturisation. Applications …

The post Binder eyes miniaturisation for M8 12-pin circular connector appeared first on Electronics Weekly .

Teledyne e2v Space Imaging is collaborating with Starris Optima Space Systems to develop space cameras for small satellites and lunar ecosystems. “Our joint development of these compact camera payloads begins …

The post Teledyne e2v hooks up with Starris Optima on cameras for small satellites appeared first on Electronics Weekly .

TSMC will break ground on its first European fab in August, reports the Nikkei, with TSMC chairman and CEO C.CWei attending, “TSMC plans to hold the groundbreaking ceremony for the …

The post TSMC to break ground on Dresden fab in August appeared first on Electronics Weekly .

Today, AWS announces the general availability of AWS IoT SiteWise Edge on Siemens Industrial Edge, offering customers a seamless way to bridge the gap between OT (Operational Technology) and IT (Information Technology) to solve industrial operational challenges. This new offering allows customers to easily connect and collect data from their industrial equipment using Siemens Industrial Edge connectivity applications and send it to the cloud using AWS IoT SiteWise Edge. Users such as process engineers and maintenance technicians can use applications on Siemens Industrial Edge to gain insights or send the data to AWS IoT SiteWise to organize, standardize, and store data for driving critical use cases such as asset monitoring, predictive maintenance, energy monitoring, and building industrial data lakes.

Within minutes, customers can collect data from their industrial equipment using Siemens connectivity applications such as OPC-UA, MQTT, Siemens S7, Modbus TCP, Profinet IO, and third-party connectors available on Siemens Industrial Edge Marketplace. They can use AWS IoT SiteWise Edge to seamlessly send this data to AWS. In the cloud, AWS IoT SiteWise enables industrial customers to improve operational efficiency and optimize asset performance by providing purpose-built, hybrid cloud-edge capabilities for analysis, storage, and enterprise-wide monitoring for industrial use cases.

AWS IoT SiteWise Edge is available in all regions where AWS IoT SiteWise is supported.

To start, visit AWS IoT SiteWise console to create a gateway, and AWS IoT SiteWise user guide to learn more.
 

Amazon AppStream 2.0 now offers support for Red Hat Enterprise Linux, enabling ISVs and central IT organizations to stream Red Hat Enterprise Linux apps and desktops to users while leveraging the flexibility, scalability, and cost-effectiveness of the AWS Cloud. With this launch, customers have the flexibility to choose from a broader set of operating systems including Red Hat Enterprise Linux, Amazon Linux 2, and Microsoft Windows.

This launch enables organizations operating in highly regulated industries to accelerate time to market, scale resources up or down with demand, and manage the entire fleet centrally through the AWS Console by streaming Red Hat Enterprise Linux apps from AppStream 2.0. Red Hat Enterprise Linux on AppStream 2.0 also enables traditional desktop apps to be converted to a SaaS delivery model without the cost of refactoring, while pay-as-you-go billing and license-included images ensure you only pay for the resources you use.

Red Hat Enterprise Linux is currently supported in all AWS Regions where AppStream 2.0 is available. Red Hat Enterprise Linux-based instances use per second billing (with a minimum of 15 minutes). For more information, see Amazon AppStream 2.0 Pricing .

To get started, log into the AppStream 2.0 console and select a Region. Next, launch a Red Hat Enterprise Linux-based Image Builder to install your applications, and create a custom image for your end users.
 

Customers in Germany can now create an AWS Account using their bank account. Upon signup, customers with a Germany billing address can now securely connect their bank account which supports the Single Euro Payment Area (SEPA) standard. Until today, signing up for an AWS account was only permitted with a debit or credit card. With this release, customers in Germany can choose to use their card or securely connect their bank account.

To link your bank account, sign up for AWS, and enter your address and billing country in Germany. When prompted to add a payment method click “Bank Account” followed by “Link your bank account”. Select your bank from the list of available banks and sign in to your bank using your online banking credentials. Signing in to your bank allows you to securely add your bank account to your AWS account and verifies that you are the owner of the bank account. By default, this bank account will be used when paying for your future AWS invoices. Signup with Bank Account is available in Germany, the first country where this feature is available.