Jet fuel prices have surged sharply in recent weeks, approaching levels last seen during the peak of the global energy crisis in 2022. Compared with gasoline or even diesel, jet …
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N-channel and P-channel mosfets in a single package
Toshiba has launched a 30V dual mosfet that integrates both N-channel and P-channel mosfets in a single package. The product is suitable for applications including single-phase brushless DC (BLDC) motor …
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Ten four-hole flange jack connector optimised for use with 1.37mm cable
Amphenol RF has introduced its first NEX10 four-hole flange jack connector optimised for use with 1.37mm cable in compact RF system designs. This four-hole flange jack connector is designed to …
The post Ten four-hole flange jack connector optimised for use with 1.37mm cable appeared first on Electronics Weekly .
Nissan to make cars for Chery at Sunderland
Nissan and Chinese car maker Chery have signed a non-binding MoU for the study of contract manufacturing for Nissan to manufacture Chery UK passenger vehicles at its Sunderland plant. Under …
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Chips Act II proposed – much like Chips Act 1
The EU has proposed a Chips Act II which will give the Commission power to invest directly in new EU-based fabs instead of requiring companies to apply for subsidies. The …
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Tiny SoM featuring NXP’s i.MX 91 targets Linux-based IoT
Direct Insight is introducing its QS91 system-on-module featuring NXP’s i.MX 91 applications processor. The Oxfordshire-based integrator says the SoM delivers an “optimised blend of security, features, and energy-efficient performance” for …
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Tessalia plans $250m packaging plant in France
Earlier this week Tessalia Technology, a packaging joint venture between Foxconn, Radiall and Thales, laid the foundation stone of an advanced semiconductor packaging facility in Le Barp, Nouvelle-Aquitaine. Patrice Caine, …
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Jedec SiC Guidelines improve reliability in WBG power electronics
JEDEC is publishing two new guidelines around the use of wide bandgap (WBG) power semiconductor materials, such as Gallium Nitride (GaN) and Silicon Carbide (SiC). There is JEP203: Guideline for …
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Overcoming durability and cost barriers for wearables and foldable devices
The rapid evolution of wearable and foldable technology is reshaping consumer electronics, writes Samudrapom Dam. As market demand grows, wearable and foldable electronic devices face critical challenges in durability and …
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AWS Glue Data Catalog Client for Apache Hive Metastore now supports Hive 3 and discovery of multiple catalogs
The AWS Glue Data Catalog Client for Apache Hive Metastore now supports Hive 3. With this update, Hive-compatible clients can now use this library to list and read multiple catalogs in the Glue Data Catalog. This client library is available as an open-source reference implementation that customers and partners can use to build their own Hive-compatible Glue Data Catalog integrations. To learn more, see AWS Glue Data Catalog Client for Apache Hive Metastore .