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Today’s Picture of the Day features the Satellite Applications Catapult launching its new Drone Test and Development Centre (DTDC), a facility at the Westcott Venture Park in Buckinghamshire.
The post Picture of the Day: Cutting the ribbon at UK Drone Test and Development Centre appeared first on Electronics Weekly .
“In the same way that Mac introduced us to personal computing and iPhone introduced us to mobile computing, Apple Vision Pro will introduce us to spatial computing,” Tim Cook said when presenting Apple’s new headset, the Vision Pro. Is it the NBT? While it is widely admired as a product, it isn’t yet clear what …
The post Welcome To Spatial Computing appeared first on Electronics Weekly .
The Advanced Packaging market, valued at $44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022 to 2028, reaching $78.6 billion in 2028, reports Yole Developpement. By contrast, the traditional packaging market is projected to have a slower 3.2% CAGR from 2022 to 2028, with a $57.5 billion market value …
The post Advanced Packaging market has 10.6% CAGR to hit $79bn in 2028 appeared first on Electronics Weekly .
Imec and AT&S – the PCB and IC substrate manufacturer – have made a major step towards realising a novel system integration approach, whereby D-Band chips and waveguides are integrated into low-cost, mass-manufacturable PCBs. This new approach paves the way for the development of compact, cost-effective, and high-performance 140 GHz (automotive) radar and 6G mobile …
The post Imec and ATS integrate D-Band chips and waveguides into cheap PCBs appeared first on Electronics Weekly .
By Steve Bush
Diodes has created a series of automotive-compliant PCI Express 3.0 packet switches for in-vehicle networking. “The architecture used enables flexible port configuration with upstream, downstream and CDEP [cross-domain end-point] ports being assigned according to requirements,” according to the company. “They can connect with up to seven different endpoints and support multi-host applications.” PI7C9X3G606GPQ offers 6-port/6-lane …
The post PCI-SIG Conference: PCIe 3.0 packet switches, qualified for automotive systems appeared first on Electronics Weekly .
A novel approach from Siemens and PDF Solutions improves yield ramp on advanced nodes and solves yield limiters through volume manufacturing. Improving yield is key to reducing manufacturing cost and maximizing profits in a highly competitive semiconductor market. While large yield limiters are addressed early in the process during yield ramp, subtle systematic layout patterns …
The post Sponsored Content: A new way to solve systematic circuit failures and boost yield appeared first on Electronics Weekly .
The U.S. Department of Energy (DOE) has announced its selection of Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers. The award is part of the COOLERCHIPS program – Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems – supported by DOE’s …
The post Intel in cooler chips project appeared first on Electronics Weekly .
By Steve Bush
Smiths Interconnect has created an EMI flange for its high-speed NXS connectors, intended for use in satellites. It interfaces between the PCB mounted receptacle and the enclosure panel or bulkhead to minimises the risk of electrical interference flowing from external sources into the enclosure, and vise versa. The EMI receptacle has a gold plated aluminium …
The post Smiths adds EMI screening to connector for satellites appeared first on Electronics Weekly .
The long-trailed merger between Vodafone and 3 was announced this morning, posing a thorny regulatory issue for the Competition and Markets Authority (CMA) the competition regulator. If it goes through, the number of traditional UK operators drops from 4 to 3. However it seems unlikely the companies would have spent months on merger talks without …
The post Voda3 is a poser for CMA appeared first on Electronics Weekly .
By Steve Bush
Step aside precision-ground solid germanium, as Flinders University has discovered an injection-mouldable plastic that can be used for the lenses of thermal imaging cameras. OK, OK, it might not be a replacement at the high-end, but ’67-poly(S-r-CPD)’ is black to visible light, and passes both medium and long-wave infra-red. “It has the potential to expand …
The post Sulphur co-polymers offer low-cost thermal imaging lenses appeared first on Electronics Weekly .