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167 300mm fabs this year; 180 next year
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes, says Knometa Research. While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly …
The post 167 300mm fabs this year; 180 next year appeared first on Electronics Weekly .
Gamesmanship
The Wimbledon final might be the last when we see the rituals of a Djokovic appearance – the extensive pre-serve ball-bouncing, extended loo-breaks, time-wasting, racquet abuse, mind games and flashes of temper. The crowd, rightly IMHO, showed their displeasure at these antics. Djokovic was on the verge of equaling three records: Most consecutive Wimbledon titles …
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Orbital wins $1.7m Space Force contract to manufacture antennas in space
Orbital Composites, an in-space robotic manufacturing specialist, has won a $1.7m U.S. Space Force contract, to further “the development of In-space Servicing, Assembly and Manufacturing (ISAM) of antennas”. Collaborating with Axiom Space, Northrop Grumman, and Southwest Research Institute (SwRI), Orbital will be working on two applications: Satellite-Based Cellular Broadband (SBCB) and Space-Based Solar Power (SBSP). …
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Turmoil at SMIC
SMIC chairman Gao Yonggang has resigned in a long line of departures, to be replaced by a vice chairman Liu Xunfeng (pictured). Gao, who was CFO before becoming chairman, had been in the job for 12 months. No reason was given for him leaving except that it was ‘a job adjustment’. The new chairman, Liu …
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167 300mm fabs operating this year; 180 next year
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes. While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production …
The post 167 300mm fabs operating this year; 180 next year appeared first on Electronics Weekly .
Hummingbird claims to be world’s first oNOC for AI workloads
The first public demonstration of Hummingbird, claimed to be the world’s first Optical Network-On-Chip for domain-specific AI workloads, will be at Hot Chips August 27-29 at Stanford University. Hummingbird uses vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into one package serving as the communications network for data centres and …
The post Hummingbird claims to be world’s first oNOC for AI workloads appeared first on Electronics Weekly .
Optalysis raises £21m Series A
Optalysis of Leeds, the ten year-old photonics specialist, has raised a £21 million Series A funding round. The company is working with Google, IBM and others on Fully Homomorphic Encryption” (FHE) which enables cloud-based processing of encrypted data and its transmission across untrusted networks. It anticipates marketing chiplet-based products using its technology in three years time. FHE protects data …
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Arduino puts Wi-Fi and Bluetooth ESP32 processor into Nano
Arduino has introduced a Nano shaped board with a Wi-Fi and Bluetooth LE capable Espressif’s ESP32-S3 microcontroller, supporting it with the Arduino IDE and MicroPython. “Beginners can explore in an easy-to-understand, welcoming environment, with a popular MCU supported by documentation and a global community of users,” said Arduino. “At the same time, more advanced users …
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Dual 12V mosfet is drain-connected for battery packs
Toshiba is aiming at battery pack protection with a 12V 20A common-drain dual n-channel mosfet. The new part is SSM14N956L and “uses Toshiba’s micro-process, in common with the already released 13.5A SSM10N954L”, according to the company. Application circuit for the earlier SSM10N954L dual mosfet Alongside the mosfets are clamp devices to protects the gates from …
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