This one for Junior Gadget Masters – from Circuit Mess – catches my eye: the Music Bundle for building and coding your own synth and DJ mixer…
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What caught your eye? (STEAM 2024, Electronic nose, Goonhilly station)
We’re talking about STEAM 2024 at Thorpe Park, creating an electronic nose without using specific sensing chemicals, and deep space communications services…
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Fable: The Company That Was Hopeful
There was once a start-up which relied on two unproven technologies – an advanced silicon compiler and a revolutionary direct-write e-beam machine The idea was that you fed a net-list …
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Former directors chart Intel’s way forward
Four former Intel board members have written a piece in Fortune describing their view of the way forward for Intel. The are: David B. Yoffie – a professor at Harvard …
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Goonhilly Earth Station funding boosts deep space comms capacity
A new £2 million contract with the UK Space Agency (UKSA) cements the importance of the Goonhilly Earth Station for providing deep space communications services. Space agencies and companies use …
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Wayve starts ADAS trials in US
Wayve, the UK ADAS developer, has expanded its US operations with the opening of a an office in Silicon Valley and the start of a driver assistance testing programme in …
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Arm puts Qualcomm on notice of cancellation of its licence
Arm has given one of its biggest customers, Qualcomm, 60 days notice of a cancellation of its architectural licence, reports Bloomberg. The move comes after a three year legal battle …
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Intel-Samsung foundry collaboration
Intel’s reported move to discuss cooperation with Samsung in their respective foundry businesses suggests that Intel is not confident it can gain process technology leadership next year. If Intel’s 18A …
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Two power ICs supply Intel’s Lunar Lake processors
Renesas is aiming at Intel’s Core Ultra 200V series of processors with a pair of power ICs. RAA225019 is a six-phase buck converter, designed to work with IMVP9.2 Lunar Lake …
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Semicon Europa: Low-warpage moulding for FOWLP wafer-level packaging
Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can …
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