The semiconductor materials market decreased 1.5% in 2015, says SEMI. Total wafer fabrication materials and packaging materials were $24.1 billion and $19.3 billion, respectively. Comparable revenues for these segments in 2014 were $24.2 billion for wafer fabrication materials and $19.8 billion for packaging materials. The wafer fabrication materials segment decreased 1% year-over-year, while the packaging …
Taiwan’s ITRI building OLED lighting line
Taiwan’s Industrial Technology Research Organization (ITRI) is building a flexible OLED lighting panel production line capable of producing 700 panels a month, reports Digitimes. Production on the roll-to-roll line is scheduled to start next year. The panels are made using thin film glass substrates. A 7cm by 7cm OLED lighting panel with luminous efficiency of …
Leti 3D chip technology gets big push from Qualcomm
A 3D chip technology, which stacks active layers of transistors without the need for through-silicon vias (TSVs) has been developed by Leti and is the focus of a collaboration with Qualcomm. Dubbed CoolCube, the French research centre has developed a device scale-stacking technology for complex system-on-chips such as mobile processors which is why Qualcomm is …
How to test small cells to meet 5G data demand
With the advent of 5G mobile services by 2020 network operators will rely on a new type of flexible basestation called the small cell to meet dramatically increasing data traffic in mobile networks and this will bring its own requirements for testing, writes Juan Hidalgo With mobile data traffic predicted to grow at a yearly …
Box data storage available on the IBM Cloud in Europe and Asia
Box co-founder and CEO, Aaron Levie, and IBM Cloud vice-president, Robert LeBlanc, have announced in London that the companies are making the Box data storage platform available on the IBM Cloud in Europe and Asia. This means that users in Europe or Asia can store their data locally. The companies will also offer a hybrid …
Box data storage available on the IBM Cloud in Europe and Asia
Top 10 PCT Applicants 2015
Thanks to the World Intellectual Property Organisation (WIPO) for this one – the top ten companies for PCT (Patent Cooperation Treaty) patents: Huawei 3,898 Qualcomm 2,442 ZTE 2155 Samsung 1,683 Mitsubishi Electric 1,593 Ericsson 1481 LG 1457 Sony 1381 Philips 1378 HP 1310
FTDI USB 2.0 Chips Support 480Mbit/s.
To provide engineers with a greater breadth of IO options and also address demands to conserve board real estate, FTDI has announced new versions of its highly popular FT2232H and FT4232H devices. These configurable USB 2.0 Hi-Speed (supporting 480Mbit/s operation) ICs are now available in 56-pin VQFN packages, which complement the 64-pin LQFP package format. …
Five tablets that might just run MPLAB-X and DesignSpark
Oh my word, I have become obsessed. I have been trying to buy a lightweight PC for two things: A little home project involving microcontroller programming and 3D printing – so MPLAB-X and DesignSpark Mechanical. Going to shows and conferences for my day job – where USB sticks full of data are common. For various …
Gadget Watch: HTC 10 smartphone snaps dual OIS
The HTC 10 – HTC has announced its own new flagship smartphone, supporting optical image stabilisation (OIS) in both cameras
Lacroix puts French manufacturing in the Top 10
Lacroix Electronics has moved into the Top 10 European electronics subcontractors, according to Reed Electronics Research. The French manufacturer specialises in electronics subcontracting for the industrial, home automation, health, automobile, civil avionics and defence sectors. Its turnover in 2015 was €280m including intra-group sales. This represented a 21.7% increase on the previous year. Lacroix Electronics …