If you are not already familiar with the Molex Ultra-Fit Power Connectors you may find yourself using them in the future.
Win a place at IoT Design 2016 conference
Don’t miss our IoT Design conference, which is running in London on Thursday 15 September. And here’s a chance to win a ticket for free entry to the important event.
Read full article: Win a place at IoT Design 2016 conference
Raspberry Pi gets a CD quality audio amp
An expansion board that adds a CD quality audio and 44/48 bit stereo record and playback to the Raspberry Pi is available at RS. Dubbed PiFi the add-on board has three audio outputs that include stereo headphones. There is a Sony/Phillips Digital Interface Format (SPDIF)-6+6 Watt speaker amplifier. The board has its own microphone and …
LED business news: Cree sells power semi unit, Sylvania socket survey, and NYC Lowline
Cree will sharpen its focus on LEDs and SSL with sale of Wolfspeed, while LEDvance and Sylvania suggest a transition to smart lamps is coming and New York will build the solar-lit Lowline.
Philadelphia Water Department to update lead testing methods
The department is updating its testing to comply with federal guidelines issued by the Environmental Protection Agency.
EPA and others address groundwater cleanup at the Nuclear Metals, Inc. Superfund Site in Concord, Mass.
The cleanup, including EPA oversight costs, is estimated at $5.7 million.
Taiwan and China Will Have 75% Of World Foundry Capacity Next Year
Taiwan and China have over 70% of the world’s foundry capacity, says SEMI, and will have 75% next year. It is no surprise that Taiwan with TSMC, UMC, VIS and Powerchip, has 55% of the world’s foundry capacity but it comes as a surprise to hear that China, with SMIC, XMC, Huali and Huahong Grace, …
Taiwan and China Will Have 75% Of World Foundry Capacity Next Year
Making IoT work for us – IoT Design programme announced
Interested in learning more about the IoT? Be sure to make a date in your diary for our IoT Design conference, which is running in London on Thursday 15 September.
Leti 3D on-chip network uses active interposer
French semiconductor research lab has developed a 3D network-on-chip (3D-NoC) for fast computing. It is intended to be used to transfer data between stacked die, or across an array of die on a silicon interposer. “The steady rise in the number of applications that require high-performance computing creates a demand for new hardware-plus-software communications solutions …
Cellular IC market to grow 6.7% CAGR 2015-19
The increasing value of the average IC content in cellular handsets and the increasing percentage of smartphones will help drive the cellphone IC market to $94.3 billion in 2019, says IC Insights. Although the cellular handset IC market grew by double digits in 2013 and 2014 it grew only 2% in 2015 and is expected …