So, 64 years ago, stated this ad from TI published in Electronics Weekly’s edition of May 3 1961

The post TI MOLY/G Diodes Available appeared first on Electronics Weekly .

A week after the Maduro Snatch, while people are debating its legality, the EU has come up with a statement stopping short of condemning it, while 74% of Republicans said …

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The newest episode of the Electronics Weekly podcast, CHIIPS, features sustainable design insights from Dr Aaron Yeardley of Tunley Environmental.

The post CHIIPS #24 – Sustainable design insights from Dr Aaron Yeardley of Tunley Environmental appeared first on Electronics Weekly .

Array Labs, a Silicon Valley startup specialising in radar payloads for satellite buses, has announced raising $20 million in Series A financing.   The investment round was led by Catapult …

The post Array Labs raises $20m Series A to scale radar manufacturing appeared first on Electronics Weekly .

Perceptra, the MIT spin-off pioneering photonic chip-based AI-enabled Raman sensors for chemical monitoring, has secured a €1.2 million investment from PhotonDelta, the Dutch photonic chip industry accelerator. The funding will …

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PowerLattice, of Vancouver, Washington State, has in progress engineering samples of a chip which reduces compute power needs by more than 50% with customer trials planned for H1 2026. “By …

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Andreessen Horowitz, the Californian VC, has raised its biggest ever fund – $15 billion. The new raise brings the funds it has under management to over $90 billion. Half of …

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Zeekr’s 7GT EV promises “Chinese technology with European design and soul” at the Brussels Motor Show for €45,990. “A true passion project, the 7GT represents our commitment as a high-end …

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Schott has created high-power TO-9 and SMD packages for laser diodes that have a copper slug that passes all the way through the base. The copper is brazed into position, …

The post SPIE Photonics West: Copper heatsink packages for laser diodes appeared first on Electronics Weekly .

NXP has created a read-write chip for high-volume RFID tag applications complying to Rain Alliance standards for UHF passive tags. It is Branded ‘Ucode X’ and delivered in wafer form. …

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