Today, AWS announces the general availability of AWS Support in Korean in all commercial regions. Customers can now select Korean, in addition to Chinese, English, and Japanese as their preferred language to interact with our team of support engineers and customer service representatives. Customers will receive personalized support in the language of their choice with predictable response times as per their Support plan at no additional cost.
Ed Gets Paranoid
Is the Civil Service out to get me? Ed asks his diary. I suppose quite a few ministers are worrying about the same thing. I’ve had sharp words with some of the rustier tools in the Departmental toolbox and would like to know how I am regarded in case I get a sudden ambush like …
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Most Read articles – Electronics production, TI Wi-Fi ICs, Arm debt
There’s a report on decline in electronics production, TI introducing a new SimpleLink family of Wi-Fi 6 companion ICs, the US Chips Act garnering 200+ statements of interest, and the danger of Arm becoming liable for $8.5 billion of Softbank debt…
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The Differences Between US and Japanese Top Management
In his book Chip Management, Tsuyoshi Kawanishi, a notable former CEO of Toshiba Semiconductors who served on the boards of both Toshiba and Applied Materials, considers the differences between US and Japanese management styles and summarises them in this graphic:
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Royal Society preps the Summer Science Exhibition 2023
Time to make a date in your diary – for the Summer Science Exhibition 2023, showcasing cutting-edge research from across the UK.
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Marvell demo-es 3nm interconnect ICs
Marvell has demo-ed silicon interconnects produced on TSMC’s 3nm process. Marvell’s 3nm silicon building blocks include 112G XSR SerDes Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect. These technologies also support all semiconductor packaging options from standard and low-cost RDL (Redistribution Layers) to silicon-based high-density interconnect. …
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UKESF ‘Future Engineering Skills in the Age of AI’ warns of UK skills shortage
The UK Electronics Skills Foundation (UKESF) has published a report, Future Engineering Skills in the Age of Artificial Intelligence, which considers the impact of AI on businesses across the UK, and the country’s potential for growth in this area. Compiled following wide industry consultation, the report concludes the UK’s role is being held back by …
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SiTime upgrades auto oscillators
SiTime has engineering samples of its its latest generation of automotive oscillators for ADAS, infotainment and car-to-home wireless connectivity. General sampling will be available in Julyand volume availability in early 2024. SiTime SiT1623/25 automotive-grade oscillators comply with the AEC-Q100 standard and provide a high-temperature, low-power timing reference for automotive connectivity protocols, including SerDes and automotive Ethernet. Automotive …
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Memory packaging revenues to grow at 13% CAGR 2022-28
Memory packaging revenues are estimated by Yole Developpement to be worth $31.8 billion in 2028 with a CAGR22-28 of 13%. DRAM will grow with a CAGR22-28 of around 13%, reaching around $20.7 billion in 2028, while NAND will grow at a faster pace, with a CAGR22-28 of around 17%, and its packaging revenue is forecast …
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King’s Awards for Enterprise 2023
The King’s Awards for Enterprise 2023 have been announced, and Electronics Weekly studied the list of winners to discover which electronics-related organisations have been honoured this year. One of the successful companies is ipTest of Guildford in Surrey, which has won in the Innovation category for its DS5 1,000A high-speed tester for SiC and GaN …
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