Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL – thin bond line) offers 5W/m.K bulk thermal conductivity and, “at a minimum bond line thickness of 0.05mm, the apparent thermal conductivity exceeds 10W/m.K”, according to the company. However, “the material is primarily for thin bond lines and is not …
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