There’s Intel’s ambitious roadmap for process, a Mannerisms post on the Sony-TSMC tie-up, STMicroelectronics manufacturing its first 200mm silicon-carbide bulk wafers in Sweden, TSMC considering building a fab in Germany and trouble in China for the Tsinghua Unigroup…
This story continues at Most Read articles – Intel roadmap, TSMC in Germany, Tsinghua Unigroup
Or just read more coverage at Electronics Weekly