Boeing and Northrop Grumman will join a programme to develop, tape-out, and fabricate test circuits in preparation for product design tape-outs using Intel’s 18A process technology. 18A is scheduled to be “manufacturing ready” in 2024 and is billed as the node which overtakes TSMC’s process technology. Nvidia, Qualcomm, Microsoft, IBM, Cadence and Synopsys are also …
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