Micron is shipping 232-layer TLC NAND flash fabbed in Singapore The device delivers I/O speed 2.4GB/s and the chip has a density of 14.6 Gb/mm2. The chip can store 1Tb which allows 2TB chip packages by stacking 16 232-layer dies. Micron has shrunk its packaging and a single chip package measures 11.5mm x 13.5mm (~155mm2). …
The post Micron shipping 232-layer NAND appeared first on Electronics Weekly .