Imec and EVG have demonstrated 1.8µm pitch overlay accuracy for wafer-to-wafer bonding. Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D integration. This is achieved by aligning top and bottom wafers that are then bonded, thus creating a stacked IC. An important advantage is that wafers/ICs with different technologies …
Read full article: Imec, EVG demo superior overlay accuracy for wafer-to-wafer bonding