Fan-out (FO) packaging revenue is expected to reach $3.8 billion in 2028, with a CAGR 2022-2028 of 12.5%, says Yole Developpement. New Chinese OSATs are penetrating the FO packaging supply chain, such as ECHINT (former ESWIN), Casmeit and Sky Semiconductor. TSMC is the biggest FO packaging player, with 76.7% of the market. Chiplets and heterogenous …
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