Researchers from Osaka University have found a way to bond copper foil to notoriously slippery polytetrafluoroethylene (PTFE). The aim is to improve the bandwidth of PCBs. “Copper is the go-to wiring material for printed wiring boards because it is highly conductive, so the focus for improvement is to decrease transmission loss from the support material,” …
This story continues at Copper bonded to PTFE for 5G digital and RF PCBs
Or just read more coverage at Electronics Weekly