Last year, CapEx investments of about $11.6 billion were made in packaging by the top players, reports Yole Developpement. Intel is the top investor, with $3.5 billion. Its 3D chip stacking technology – Foveros – consists of stacking a die on an active silicon interposer. An embedded multi-die interconnect bridge is its 2.5D packaging solution, …
This story continues at $11.6bn invested in packaging last year
Or just read more coverage at Electronics Weekly